KINGMAX Semiconductor Inc., a global memory technology leader, continues to make the development of its own KINGMAX brand memory module products its major strategy. Following the release of the Mars Series ultra-fast DDR2 memory module for desktop computers, KINGMAX has launched two brand-new ultra-fast memory products for notebook computers, the DDR2 400MHz SO-DIMM and the DDR-2 533MHz SO-DIMM. These new memory modules stand out for their high stability, compatibility, high-speed data transfer and bandwidth as well as excellent thermal dispersion capabilities. Kingmax's new SO-DIMM is the first to support the all new high-speed DDR2 notebook platforms and meets the demanding requirements of the digital era, whether it is data transmission efficiency, application functionality or capacity. As industries around the globe seek to make production less harmful to the environment, KINGMAX has adopted a lead-free process for the manufacturing of its DDR2 SO-DIMM memories, using lead-free IC dies, PCB, and soldering material, thus fully meeting environmental protection standards of North America, Europe, Japan, and China.

KINGMAX DDR2 SO-DIMM memory modules are made to JEDEC specifications using new-generation, high-speed DDR2 technology. Thanks to their design, these new memory modules support a lower work voltage of 1.8V, which saves up to 50% on power consumption. KINGMAX DDR2 SO-DIMM memory boasts data speeds of up to 266MHz with a memory bandwidth of 3.2/4.3GB/s and 200 pins. The new memory modules also use ODT (on-die-termination) technology to maintain signal waves at high speeds, thus minimizing noise interference and greatly enhancing overall system performance.

KINGMAX DDR2 SO-DIMM memory products for notebook computers feature:
- 200-pin 400MHz or 533MHz DDR module
- CAS latency: 4
- Voltage: 1.8V, reducing power consumption by approximately 50%; high thermal dispersion
　capabilities
- Available memory capacity: 256MB/512MB/1GB (1GB to be launched in December 2004)
- High compatibility and high stability
- Global lifetime warranty

As mass production of DDR2 wafers is still limited worldwide, the entire series of KINGMAX DDR2 memory module products is produced with 0.10 micron-technology DDR2 dies from original manufacturers (Samsung, Elpida, and Micron) that have been rigorously tested for quality using the most advanced equipment available. To meet users' eager anticipation, KINGMAX plans to launch DDR2 memory module products that use our patented TinyBGA packaging technology early next year, when DDR2 wafers are expected to become available in large quantities. Thanks to its mature and unique design, Kingmax's DDR2 SO-DIMM optimally disperses heat generated during signal transmission, which translates into excellent heat dissipation capability, and the highest quality and stability. Furthermore, KINGMAX's TinyBGA Stacked technology easily allows more memory capacity, giving KINGMAX the distinctive edge over its rivals when it comes to new generation, high bandwidth DDR2 memory products.

KINGMAX DDR2 SO-DIMM memory modules undergo rigorous testing before leaving the factory to ensure 100% conformity and compatibility. The 256MB and 512MB versions of these two new memory modules are already being mass produced and sold in the market, and large quantities of 1GB DDR2-533MHz SO-DIMM memory modules will become available in December this year, which will trigger high market demand