Kingmax recently launched the Mars DDRII 667 memory, which is embedded with a red ASIC decoder chip and the company's proprietary TinyBGA color packaging technology. This new Kingmax memory product is 100% counterfeit-proof, and symbolizes the fiery, strong heart of Mars, the god of war.

In terms of technical specifications, Mars DDRII 667 is equipped with up to 8.6GB/s memory bandwidth and fully supports Prescott/Tejas 1067MHz FSB and direct integration of ODT technology increases system stability. With a low 1.8 volts of working voltage that cuts power consumption by 50%, the Mars DDRII 667 can run at JEDEC standard 4-4-4-12 latency timings, making it the perfect support for all new-generation DDRII high-speed computers. Just as DDR has replaced SDRAM, DDRII -- with its new specifications and powerful functions -- will soon replace current DDR specifications as the market mainstream.

New-generation DDRII memory requires high technical expertise on the part of memory module manufacturers. At Kingmax, a memory chip is considered to be up to standard only after it has passed the pre-processing, post-processing, inspection, packaging and testing stages. During the pre-processing stage, the silicon wafer is cut into small chips and simple EDS testing is carried out, completing testing on most chip functions. The post-processing stage involves I/O (input/output) configuration and protection, while the inspection stage covers full testing of the entire chip. During the final stage, chips that have passed inspection are packaged and tested again, and only fully compliant chips are used in the making of memory modules. Only DDRII memory produced under such a strict process can offer guaranteed performance, stability and compatibility.

Packaging technology, in particular, determines a memory module's working stability. Currently, most DDRs and SDRAMs use the TSOP packaging method, but BGA packaging is mandatory for DDRII according to JEDEC standards. With BGA packaging, there is a wider space at the bottom of the chip, which allows for a higher pin count while guaranteeing larger spacing between pins and meets the higher density signal input/output requirements essential for DDRII. Furthermore, BGA packaging offers other advantages, such as easy chip installation, better electrical performance, less delay in signal transmission, which allow for high-frequency operation and excellent heat dispersion.

Kingmax developed BGA packaging technology eight years ago and has successfully utilized it in the mass production of its SDRAM and DDR products. This proprietary patented technology – TinyBGA-- is highly recognized in the industry. Kingmax has used this cutting-edge technology since the SDRAM PC66/100 era, when it was used only with high-end semiconductor products (e.g. CPU). With over eight years of experience, Kingmax is extensively equipped to handle the exacting challenges faced in BGA packaging, including technical expertise, equipment upgrades and personnel training.

Kingmax is the world's only memory module maker to possess its own packaging and testing equipment. As part of its move to embrace the new DDRII era, Kingmax has recently spent nearly US$10 million to purchase T5593 testing equipment. This high-tech equipment enables the testing of higher clock rate DDRII memory and ensures the highest quality for Mars DDRII 667. Furthermore, as the world's top memory module maker, Kingmax maintains a close partnership with major motherboard makers. All Kingmax memory products are 100% tested on actual equipment and verified by major motherboard makers for stability and compatibility before shipment. This allows Kingmax to offer a lifetime original manufacturer's warranty for all of its memory products.

Kingmax's strong technical background evokes the power of Mars. When facing market challenges, Kingmax will display extraordinary perseverance and determination in the spirit of Mars to win the best opportunities.