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| Kingmax
DDR II ˇV a New Heaven The Kingmax Mars Series DDRII-800 Poised to Take the Memory Market by a Storm 2005/09/05 |
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Intel's recent release of the 955X/945 chipset quickly captured the attention of many major motherboard manufacturers. The new 955/945 chipset supports 1066 MHz FSB and DDRII memory, with increased capacity for the latter. Intel's latest chipset roadmaps indicate that the Broadwater chipset, which is set for launch in Q2 2006, will also support dual channel DDRII800 memory. In addition, according to recent news, AMD will soon be releasing an upgraded memory controller for its Athlon 64 and Opteron platforms, with full support for DDRII. Suffice to say, the age of DDRII has arrived. Most memory manufacturers hold large ambitions for the DDRII market today. Indeed, the arrival of the DDRII age is an once-in-a-lifetime opportunity that will test the true technical strength of memory manufacturers. The Kingmax DDRII 800 will soon make its debut after the DDRII 533/667 completes mass production and once again prove its capabilties as a top memory manufacturer. In the earlier part of the year at Cebit Hannover and Computex Taipei, Kingmax first unveiled the new DDRII 800 memory, which consumers will be seeing on the market very soon. Kingmax is the world's number number one manufacturer with its own packaging and testing advanced equipment for memory modules. With a complete, vertically integrated supply chain, Kingmax operates its own packaging facilities and handles the entire manfacturing process from purchasing and dicing of wafers, testing and packaging, to testing of the finished product. For the past seven years, Kingmax has been developing its Ball Grid Array (BGA) packaging and has successfully applied the process to mass production of its SDRAM and DDR products. This proprietary patented memory technology -- TinyBGA packaging technology -- is widely lauded in industry circles. With our technical discipline, state-of-the-art equipment, and personnel training, Kingmax has proven its capabilities in performing the strict tests required for BGA packaging. In Q2 of this year, Kingmax started to use T5593 testing equipment in its operations ˇV an investment worth nearly USD 10 million. Because of the high cost, very few factories use such high-tech equipment; as a result, testing output from even the most advanced IC packaging testing manufacturers is limited. As a leading manufacturer of memory modules, Kingmax has also made large investments in R&D and testing and production facilities. With T5593 equipment, Kingmax is able to perform strict tests to ensure speeds over 800MHz on our memory chips, and mass produce the highest-quality DDRII-800 memory module available. Kingmax has devoted its efforts to researching lead-free production process technologies, and gives equal consideration to the environment and product efficiency. Our high-quality DDRII memory chips are lead-free ˇV we produce all chips under environmentally-friendly conditions, use lead-free IC chips, and employ environmentally-suitable soldering materials and temperatures in PCB and SMT production. Kingmax chips have also passed high-temperature tests, and fully conform to the European Union's RoHS directive as well as the environmental requirements of the US, Japan, and China. With our lead-free manufacturing process and mass production capabilities, Kingmax continues to hold the upper hand with its future competitiveness. Kingmax Mars DDRII-800 Long-DIMM: |
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