Intel's recent announcement of its new mobile platform – Napa – has propelled the already rapidly developing mobile technology industry into the third generation. The announcement also implies that dual-core systems will soon be available for notebooks. In only one short year, Intel has exceeded Moore's Law in the evolution from Sonoma to Napa, and once again proven its undisputed superiority in the CPU industry.

The Napa architecture consists of three components, the CPU, chipset and wireless module, all of which have been updated with the new generation— the Intel 945 series chipset, Intel Core processor and Intel 3945ABG wireless module. The biggest differences between Napa and the second-generation Sonoma platform are the upgrade of the front-side bus to 667MHz, support for PCI Express x16 and DDRII 667 memory. The Intel Core will be available in single and dual-core configurations built on a 65 nm process. The Intel Pro/Wireless 3945ABG wireless module is compatible with 802.11a/b/g wireless protocols. Most importantly, the Napa platform modules are extremely small, providing more flexibility for a wider variety of notebook designs, and the new platform provides a reduction in power consumption of 1.2W, leading to longer battery life and improved performance.

If the Sonoma platform brought notebooks into the DDRII age, Napa presents another leap forward in notebook memory specifications, as DDRII 667 will follow the growth of the Napa platform to become the mainstream memory of choice for notebooks. The advantage of DDRII memory in mobile platforms is its low-power advantages. However, mass production of notebook DDRII memory is no simple feat. Currently only a handful of memory manufacturers have the capacity to mass-produce DDRII 667 SO-DIMM modules.

Packaging and testing requirements for notebook DDRII 667 memory pose considerable challenges for memory makers. It is well known by now that BGA is the default packaging format for DDRII memory. What this means is that, in the DDRII era, only companies who possess substantial BGA packaging technology capabilities will be able to achieve broad market acceptance. Only those companies who have accumulated years of technology experience and possess the core BGA packaging technologies will be able to compete.

Kingmax is one of the few companies who possess these advantages. As the only memory module maker in the world with its own advanced packaging and testing facilities, Kingmax has a complete, vertically integrated supply chain. Kingmax operates its own packaging facilities and handles the entire manufacturing process from purchasing and dicing of wafers, testing and packaging to finished product testing. Kingmax developed BGA packaging technology eight years ago and has successfully utilized it in the mass production of its SDRAM and DDR products. This proprietary patented technology – TinyBGA – is highly praised throughout the industry. Kingmax is fully equipped to handle the exacting challenges of BGA packaging, including technical expertise, equipment upgrades and personnel training.

Kingmax also has considerable expertise in the IC testing field. In 2005, Kingmax invested US$10 million to bring in the latest T5593 testing equipment. Because of its high cost, only a small number of memory manufacturers possess this advanced testing instrument, and even dedicated IC packaging and testing fabs can provide only limited capacity. With the T5593, Kingmax can filter out the highest frequency chips and use those for mass production. For Kingmax, this means the ability to lead the market using its own technology to solidify its position at the forefront of the industry.

At the same time, Kingmax also possesses significant advantages in notebook memory compatibility issues. Kingmax has strategic partnerships with nearly all of the world's major notebook manufacturers, and conducts cooperative development during the design stage to test memory for compatibility with a wide variety of notebook specifications. For the major notebook brands, Kingmax has already completed initial compatibility testing. Additionally, each Kingmax memory module undergoes strict testing for stability and compatibility prior to shipment to ensure optimum performance on a wide variety of notebook platforms.

Kingmax announced its latest Venus series DDRII 667 SO-DIMM modules at the 2005 Computex Taipei exhibition. Since then, Kingmax has completed all the preparations for mass production and the Kingmax DDRII 667 SO-DIMM modules are now available on the market. This memory series provides all of the functions for the latest memory trends in terms of data transfer frequencies, application performance and compatibility.

Additionally, as industries around the globe seek to make production less harmful to the environment, KINGMAX has adopted a lead-free process for the manufacturing of its DDR2 SO-DIMM memory, using lead-free IC dies, PCB, and soldering material, thus fully meeting the environmental protection standards of North America, Europe, Japan, and China.

Kingmax's next generation DDRII memory architecture technology complies with JEDEC standards for DDRII 667 SO-DIMM high-specification memory, and supports lower working voltage design (1.8V), which can reduce power consumption by approximately 50%. With a working frequency of 333MHz, the SO-DIMM memory can take advantage of up to 5.3GB of memory bandwidth with its 200pin configuration. Additionally, integrated ODT (on-die-termination) technology maintains memory signal waves at high speeds, minimizing noise interference. All of these advantages combine to provide outstanding performance for the entire system for consumers.

Kingmax DDRII 667 SO-DIMM Notebook Memory Features
- 200-pin 667MHz DDRII
- CAS Latency: 5
- Voltage: 1.8V, reduces power consumption by approximately 50%;
　outstanding heat dispersion features
- Capacity: 256MB/512MB/1GB
- High degree of compatibility and stability
- Global lifetime warranty